Soft finishing pad for removal of light defects and swirls e.g. in combination with Koch Chemie Micro Cut M3.02 and Micro Cut & Finish P3.01.
The low height of 23mm creates lower torsional forces, very good handling and highest stability. The special density of the foam material allows a long lasting compression hardness during polishing. The optimized reticulation (open-cell) and cell count contribute to high abrasiveness. The milled edge provides more flexibility of the pad to better conform to contours.
Velcro color-matched to the polish ensuring process reliability.
Crush hardness: 10. Abrasiveness: 5.
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