Soft finishing pad for high gloss polishes or application of sealants e.g. in combination with Koch Chemie 1K-Nano oder Lack-Polish grün P1.01.
The low height of 23mm creates lower torsional forces, very good handling and highest stability. The special density of the foam material allows a long lasting compression hardness during polishing. The optimized reticulation (open-cell) and cell count contribute to high abrasiveness. The milled edge provides more flexibility of the pad to better conform to contours.
Velcro color-matched to the polish ensuring process reliability.
Crush hardness: 4. Abrasiveness: 2.
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